品牌凝锋 | 型号环保 |
加工定制是 | 粘度270Pa·S |
颗粒度25um | 合金组份Sn |
活性R | 类型活性 |
清洗角度免洗 | 熔点227 |
规格500g |
品牌凝锋 | 型号环保 |
加工定制是 | 粘度270Pa·S |
颗粒度25um | 合金组份Sn |
活性R | 类型活性 |
清洗角度免洗 | 熔点227 |
规格500g |
1.锡膏的概念与基本特征:
锡膏是由焊料合金粉末与助焊剂/载体系统按照一定比例均匀混合而成的浆状固体;
锡膏的粘度具有流变特性,即在剪切力作用下粘度减小以利于印刷,而印刷之后粘度恢复,从而在再
流焊之前起到固定电子元器件的作用;
在再流焊过程中焊料合金粉末熔化,在助焊剂去除氧化膜的辅助作用下润湿电子元器件外引线端和印
刷电路板焊盘金属表面并发生反应,最终形成二者之间的机械连接和电连接。
2.锡膏产品的基本分类:
根据焊料合金种类,可分为含铅锡膏与无铅锡膏;
根据清洗方式及有无,可分为松香基锡膏、水溶性锡膏与免清洗锡膏;
根据活性剂种类,可分为纯松香基锡膏、中等活性松香基锡膏、高活性松香基锡膏与有机物基锡膏;
根据涂敷方式,可分为范本印刷用锡膏、丝网印刷用锡膏与滴注用锡膏
优点:
★采用了专用的助焊膏配方其残留物极少,且色泽淡。
★其焊接性***,能在各种镀层的被焊面完好焊接。
★可选择多种包装方式:针铜式和罐装。
★可针对特别的焊接工艺调整助焊膏。
产品合金成份及物理特性
目前无铅焊料主要有SnCu、SnAg、SnAgCu、SnCuNi、SnBi等合金成份配置而成。
型号 | SAC305 | SBi58 | SAC305 | SBi58 | SAC305 | SBi58 |
合金成份 | SnAg3Cu0.5 | SnBi58 | SnAg3Cu0.5 | SnBi58 | SnAg3Cu0.5 | SnBi58 |
熔点 | 217℃ | 138℃ | 217℃ | 138℃ | 217℃ | 138℃ |
锡粉粒度 | 20-45um | 20-45um | 20-63um | 20-63um | 20-63um | 20-63um |
金属含量 | 89% | 89% | 89% | 89% | 89% | 89% |
粘度(Pa_S) | 180-220 | 180-220 | 160-200 | 160-200 | 160-200 | 160-200 |
用途 | SMT通用 | SMT通用 | 高频头插件 | 高频头插件 | 散热器专用 | 散热器专用 |
包装:塑胶瓶包装,0.5公斤/瓶。
1.品质好,润湿性***。
2.有广泛的应用领域,可以专门制造手机,笔记本电脑,数码相机等高端复杂电子产品制造。
3.焊接性***,能在各种镀层的被焊面完好焊接。
4.润湿性极好,对不易上锡产品板材均有***的上锡效果。
5.可以用于精密产品制造,如:连接器,QFN,QFP等高精密产品制造。
性能:
1.印刷滚动性及落锡性好,对低至0.3mm间距焊盘也能完成精美的印刷(T6);
2.连续印刷时,其粘性变化极少,钢网上的可操作寿命长,超过12小时仍不会变干,仍保持良好的印刷效果;
3.印刷后数小时仍保持原来的形状,基本无塌落,贴片元件不会产生偏移移;
4.具有***的焊接性能,可在不同部位表现出适当的润湿性;
5.可适应不同档次焊接设备的要求,无需在充氮环境下完成焊接,在较宽的回流焊炉温范围内仍可表现良好的焊接性能。用“升温---保温式”或“逐步升温式”两类炉温设定方式均可使用;
6.焊接后残留物极少,颜色很浅且具有较大的绝缘阻抗,不会腐蚀PCB,可达到免洗的要求;
7.具有较佳的ICT测试性能,不会产生误判;
8.有针对BGA产品而设计的配方,可解决焊接BGA方面的难题。
Solder paste:
solder paste is a design for today's SMT production process no-clean solder paste. Minimal amount of oxidation using lead-free alloys and inactive better help paste formulated, viscosity can meet the printing and dispensing technology, wide range of applications.
★adapt to a variety of electronic circuit boards installed linking the various sectors of lead-free soldering processes.
★adapt to a variety of lead-free solder dip tin or components.
★but also for a variety of special process of welding.
★It also can be deployed to meet customer production of lead-free solder according to the customer's actual production.
Benefits:
★Using a dedicated help paste formulation which very little residue, and the light color.
★weldability strong, good welding can be welded in a variety of coating surface.
★choose a variety of packaging: copper needle type and canned.
★can adjust for special welding flux paste.
Product alloy composition and physical properties
Currently there are lead-free solder SnCu, SnAg, SnAgCu, SnCuNi, SnBi other alloying ingredients dispositions.
Model SAC305 SBi58 SAC305 SBi58 SAC305 SBi58
Alloy composition SnAg3Cu0.5 SnBi58 SnAg3Cu0.5 SnBi58 SnAg3Cu0.5 SnBi58
A melting point of 217℃138℃217℃138℃217℃138℃
Tin powder particle size 20-45um 20-45um 20-63um 20-63um 20-63um 20-63um
Metal content 89% 89% 89% 89% 89% 89%
Viscosity (Pa_S) 180-220 180-220 160-200 160-200 160-200 160-200
General purpose SMT SMT plug Universal LNB LNB plug radiators for radiators for
Packaging: plastic bottles, 0.5 kg / bottle.
1. Good quality, excellent wettability.
2. There is a wide range of application areas, we can specialize in manufacturing mobile phones, laptop computers, digital cameras and other high-end electronics manufacturing complex.
3. weldability strong, good welding can be welded in a variety of coating surface.
The excellent wettability for easy on tin plate products have excellent effect on the tin.
5. Can be used in precision manufacturing, such as: connectors, QFN, QFP high-precision manufacturing.
Performance:
1. Printing rolling off the tin and good, up to 0.3mm pitch pads can also complete the fine print (T6);
2. When the continuous printing, the viscosity changes very little, long-life steel operatively online, more than 12 hours is still not become dry, still maintain good printing results;
3. After printing a few hours remain the original shape, almost no collapse, no SMD components offset shift;
4. has excellent welding performance, in different parts of the exhibit appropriate wettability;
5. Can adapt to the requirements of different grades of welding equipment, welding without complete under nitrogen environment, in a wide range of reflow oven can still perform well weldability. With "warming --- insulation" or "gradual warming formula" categories oven setting mode can be used;
6. very little residue after soldering, the color is very light and has a large insulation resistance, will not corrode PCB, disposable requirements can be achieved;
7. ICT test has better performance, no miscarriage of justice;
8. Designed for BGA product formulations, solve welding BGA aspects of the pro
企业类型 | 有限责任公司(自然人投资或控股) | 统一社会信用代码 | 91441900595817158N |
---|---|---|---|
成立日期 | 2012-04-29 | 法定代表人/负责人 | 李志攀 |
注册资本 | 50万(元) | 注册地址 | 广东省东莞市大朗镇大井头顺兴二路68号2栋601室 |
营业期限 | 2012-04-29 至 无固定期限 | 登记机关 | 东莞市市场监督管理局 |
经营范围 | 销售:电子产品、五金制品、塑胶制品;生产、销售:交流风扇、直流风扇、马达、横流风扇、鼓风机、散热器;货物进出口、技术进出口。(依法须经批准的项目,经相关部门批准后方可开展经营活动) |